chips

PAI Cristal > chips

Showing 10–12 of 12 results

  • PLA HCP

    PLA HCP

    • Abrasive strenght: high
    • Shape: pyramid
    • Sizes: 10-20
    • Hardness: 3/5
    • Duration: 3/5
    • Step: grinding, frosting, deburring
    • Target: removing of burr caused by shearing, pressing and lasering
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  • PLA HCCAP

    PLA HCCAP

    • Abrasive strenght: high
    • Shape: cone
    • Sizes: 10 – 12 – 20 – 30 – 40
    • Hardness: 3/5
    • Duration: 43/5
    • Step: grinding, frosting, deburring
    • Target: removing of burr caused by shearing, pressing and lasering
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  • PLUR CAP

    PLA LCCAP

    • Abrasive strenght: low
    • Shape: cone
    • Sizes: 10 – 12 – 20 – 30
    • Hardness: 4/5
    • Duration: 4/5
    • Step: grinding, smoothing
    • Target: removing of low welding traces, leaving a matt surface
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